Semiconductor chip assembly with bumped conductive trace

A semiconductor chip assembly, comprising:

• a semiconductor chip that includes a conductive pad;
• a conductive trace that includes a bumped terminal and a routing line, wherein the bumped terminal includes a cavity that faces towards the chip, the bumped terminal is disposed within a periphery of the chip and outside a periphery of the pad, and the routing line is a planar metal lead that is contiguous with the bumped terminal and overlaps the pad;
• an insulative adhesive that contacts and is sandwiched between the conductive trace and the chip and fills the cavity;
• and
• a connection joint that extends through an opening in the adhesive and contacts and electrically connects the conductive trace and the pad.

A semiconductor chip assembly, comprising:

• a semiconductor chip that includes a conductive pad;
• a conductive trace that includes a bumped terminal and a routing line, wherein the bumped terminal includes a cavity that faces towards the chip, the bumped terminal is disposed outside a periphery of the chip, and the routing line overlaps the pad;
• an insulative adhesive that contacts and is sandwiched between the conductive trace and the chip;
• an encapsulant that covers the chip on a side opposite the pad and extends into the cavity;
• and
• a connection joint that extends through an opening in the adhesive and contacts and electrically connects the conductive trace and the pad.

A semiconductor chip assembly, comprising:

• a semiconductor chip that includes a conductive pad;
• a conductive trace that includes a bumped terminal and a routing line, wherein the bumped terminal includes a cavity that faces towards the chip, the bumped terminal is disposed outside a periphery of the chip, and the routing line is a planar metal lead that is contiguous with the bumped terminal and overlaps the pad;
• an insulative adhesive that contacts and is sandwiched between the conductive trace and the chip;
• an encapsulant that contacts the chip on a side opposite the pad and fills the cavity;
• and
• a connection joint that extends through an opening in the adhesive and contacts and electrically connects the conductive trace and the pad.

A semiconductor chip assembly, comprising:

• a semiconductor chip that includes a conductive pad;
• a conductive trace that includes a bumped terminal and a routing line, wherein the bumped terminal includes a cavity that faces towards the chip, the bumped terminal is disposed within a periphery of the chip and outside a periphery of the pad, and the routing line overlaps and is electrically connected to the pad;
• an adhesive that contacts and is sandwiched between the conductive trace and the chip and extends into the cavity;
• and
• a connection joint that extends through an opening in the adhesive and contacts and electrically connects the conductive trace and the pad, wherein the connection joint contacts a surface of the conductive trace that overlaps and faces away from the pad, the connection joint contacts opposing peripheral sidewalls of the conductive trace that overlap and are orthogonal to the pad, the connection joint is the only electrical conductor external to the chip that contacts the pad, the connection joint and the adhesive are the only materials external to the chip that contact the pad, the connection joint and the adhesive are the only materials that contact both the conductive trace and the pad, and the adhesive contacts and is sandwiched between the conductive trace and the pad.

A semiconductor chip assembly, comprising:

• a semiconductor chip that includes a conductive pad;
• a conductive trace that includes a bumped terminal and a routing line, wherein the bumped terminal includes a cavity that faces towards the chip, the bumped terminal is disposed within a periphery of the chip and outside a periphery of the pad, and the routing line is a planar metal lead that is contiguous with the bumped terminal and overlaps the pad;
• an adhesive that contacts and is sandwiched between the conductive trace and the chip and fills the cavity;
• and
• a connection joint that contacts and electrically connects the conductive trace and the pad.

A semiconductor chip assembly, comprising:

• a semiconductor chip that includes a conductive pad;
• a conductive trace that includes a bumped terminal and a routing line, wherein the bumped terminal includes a cavity that faces towards the chip, the bumped terminal is disposed outside a periphery of the chip, and the routing line overlaps and is electrically connected to the pad;
• an adhesive that contacts and is sandwiched between the conductive trace and the chip;
• an encapsulant that covers the chip on a side opposite the pad and extends into the cavity;
• and
• a connection joint that extends through an opening in the adhesive and contacts and electrically connects the conductive trace and the pad, wherein the connection joint contacts a surface of the conductive trace that overlaps and faces away from the pad, the connection joint contacts opposing peripheral sidewalls of the conductive trace that overlap and are orthogonal to the pad, the connection joint is the only electrical conductor external to the chip that contacts the pad, the connection joint and the adhesive are the only materials external to the chip that contact the pad, the connection joint and the adhesive are the only materials that contact both the conductive trace and the pad, and the adhesive contacts and is sandwiched between the conductive trace and the pad.

A semiconductor chip assembly, comprising:

• a semiconductor chip that includes a conductive pad;
• a conductive trace that includes a bumped terminal and a routing line, wherein the bumped terminal includes a cavity that faces towards the chip, the bumped terminal is disposed outside a periphery of the chip, and the routing line is a planar metal lead that is contiguous with the bumped terminal and overlaps the pad;
• an adhesive that contacts and is sandwiched between the conductive trace and the chip;
• an encapsulant that contacts the chip on a side opposite the pad and fills the cavity;
• and
• a connection joint that contacts and electrically connects the conductive trace and the pad.