Transformer comprising stacked inductors
AssigneeSkyworks Solutions, Inc.
InventorSiamak Fazelpour
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Abstract
A transformer fabricated over a semiconductor die has been disclosed. A disclosed embodiment comprises a first inductor fabricated over a first bond pad. The first inductor is electrically connected to the first bond pad. For example, the bond pad can comprise copper, aluminum, copper-aluminum alloy, or gold. The disclosed embodiment further comprises a dielectric deposited over the first inductor. The disclosed embodiment further comprises a second inductor fabricated over the dielectric. For example, the dielectric can comprise BCB or low-k polyimide. Also, by way of example, the first and the second inductor can comprise copper, aluminum, copper-aluminum alloy, or gold.
Claims20
A structure comprising:
- a first inductor fabricated over a first bond pad, said first inductor being electrically connected to said first bond pad;
- a dielectric deposited over said first inductor;
- a second inductor fabricated over said dielectric, said second inductor being cross-coupled with said first inductor;
- said first inductor, said dielectric, and said second inductor being encapsulated in a package.
A structure comprising:
- a first inductor fabricated over a first bond pad, said first inductor comprising a first metal, said first bond pad comprising a second metal, said first inductor being electrically connected to said first bond pad;
- a dielectric deposited over said first inductor;
- a second inductor fabricated over said dielectric, said second inductor comprising a third metal;
- said second inductor being electrically connected to a second bond pad, said second bond pad comprising said second metal, said second inductor being cross-coupled with said first inductor.
Dependencies are inferred from the claim text.