Dummy pattern for improving micro-lens formation in an image sensor
AssigneeHua Wei Semiconductor (Shanghai) Co., Ltd.
InventorKatsumi Yamamoto
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Abstract
An image sensor die formed on a wafer is disclosed. The image sensor die comprises a plurality of pixels formed in a semiconductor substrate, each pixel including a light sensitive element. Further, a dummy pattern is formed on the image sensor die, wherein the dummy pattern comprises ridges of a dummy pattern material that is operative to evenly distribute a micro-lens material over said wafer.
Claims10
An image sensor die formed on a wafer, said die comprising:
- a plurality of pixels formed in a semiconductor substrate, each pixel including a light sensitive element;
- a dummy pattern formed on said die, said dummy pattern comprising ridges of a dummy pattern material and operative to evenly distribute a micro-lens material over said wafer;
- and
- a color filter formed over each pixel, said dummy pattern material being the same material as said color filter.
An image sensor die formed on a wafer, said die comprising:
- a plurality of pixels formed in a semiconductor substrate, each pixel including a light sensitive element;
- and
- a dummy pattern formed on said die, said dummy pattern comprising ridges of a dummy pattern material and operative to evenly distribute a micro-lens material over said wafer, said dummy pattern comprising a plurality of arcuate segments that are convex to the exterior of said image sensor die.
A semiconductor wafer containing a plurality of image sensor die, said die comprising:
- a plurality of pixels formed in a semiconductor substrate, each pixel including a light sensitive element;
- a dummy pattern formed on said die, said dummy pattern comprising ridges of a dummy pattern material and operative to evenly distribute a micro-lens material over said wafer;
- and
- a color filter formed over each pixel, said dummy pattern material being the same material as said color filter.
A semiconductor wafer containing a plurality of image sensor die, said die comprising:
- a plurality of pixels formed in a semiconductor substrate, each pixel including a light sensitive element;
- and
- a dummy pattern formed on said die, said dummy pattern comprising ridges of a dummy pattern material and operative to evenly distribute a micro-lens material over said wafer, said dummy pattern comprising a plurality of arcuate segments that are convex to the exterior of said image sensor die.
Dependencies are inferred from the claim text.