Light-emitting chip device with case and method of manufacture thereof
AssigneeRohm Co., Ltd.
InventorHiroki Ishinaga
Life of this patent
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Abstract
A chip-type light-emitting device (10) with case includes a chip (12), and the chip is die-bonded onto an electrode (16a) formed on a substrate (14). Furthermore, the light-emitting device includes a case (20) having holes (24a, 24b) at an approximately center of respective lower portions on first side surfaces of the case, and steps (26a, 26b) formed on respective upper edges of second side surfaces. A transparent resin for sealing the chip is filled from the holes to be filled in the case 2. At this time, the transparent resin is flowed from bottom to top in the case, and an air is discharged from an air vent which includes the steps.
Claims6
A chip-type light-emitting device with case, in which said case has an outer periphery including two first side surfaces opposite to each other and two second side surfaces sandwiched by said first side surfaces and an inner periphery defining a hollow portion wherein a chip is bonded onto a substrate formed with electrodes, and a resin is filled as a sealant in said hollow portion so as to cover said chip on said substrate, comprising:
- holes formed at lower portions on first opposite side surfaces of said case, said holes communicating said outer periphery to said hollow portion such that said resin can be injected into said hollow portion via said holes;
- and
- steps formed on upper edges of said second side surfaces, said steps communicating said outer periphery to said hollow portion such that in injecting said resin into said hollow portion an air can be discharged from said hollow portion via said steps.
A method of manufacture for a chip-type light-emitting device with case, comprising steps of:
- (a) preparing a case having an outer periphery including two first side surfaces opposite to each other and two second side surfaces sandwiched by said first side surfaces and an inner periphery defining a hollow portion, holes being formed at lower portions of said first side surfaces and steps being formed on upper edges of said second side surfaces;
- (b) bonding a chip onto a substrate;
- (c) arranging said case on said substrate in a manner that said chip bonded onto said substrate is positioned within said hollow portion of said case;
- and
- (d) injecting a resin from said holes into said hollow portion to form a sealant which covers said chip while discharging air from said steps, said holes communicating said outer periphery to said hollow portion such that said resin can be injected into said hollow portion via said holes, said steps communicating said outer periphery to said hollow portion such that in injecting said resin into said hollow portion an air can be discharged via said steps.
Dependencies are inferred from the claim text.