Information reading apparatus, method of producing same, and radiation imaging system having same
AssigneeCanon Kabushiki Kaisha
InventorsSatoshi Okada, Masakazu Morishita, Chiori Mochizuki
Life of this patent
Estimating the term…
Abstract
In order to prevent a scintillator of an information reading apparatus from being broken in a bonding step, a protective layer is formed so as to cover the scintillator so that the shape of the scintillator is not broken.
Claims16
An information reading apparatus comprising a wavelength conversion means having a wavelength conversion member provided on a first substrate, a sensor substrate having a plurality of photoelectric conversion elements arranged on a second substrate, the wavelength conversion means and the sensor substrate being bonded to each other, and a buffer layer provided between the wavelength conversion member and the photoelectric conversion elements, wherein the buffer layer comprises a first protective layer comprised of an organic material for protecting the wavelength conversion member and a second protective layer comprised of an organic material for protecting the plurality of photoelectric conversion elements, and wherein the buffer layer acts as an impact-resistant layer during bonding of the wavelength conversion means and the sensor substrate.
A method of producing an information reading apparatus which includes a wavelength conversion means having a wavelength conversion member provided on a first substrate, a sensor substrate having a plurality of photoelectric conversion elements arranged on a second substrate, and a buffer layer provided between the wavelength conversion member and the photoelectric conversion elements, wherein the buffer layer comprises a first protective layer comprised of an organic material for protecting the wavelength conversion member and a second protective layer comprised of an organic material for protecting the plurality of photoelectric conversion elements, comprising the steps of:
- forming a resin layer as the first protective layer of the buffer layer on the wavelength conversion means;
- applying an adhesive to the sensor substrate;
- and
- bonding the wavelength conversion means and the sensor substrate to each other such that the wavelength conversion means is located on the adhesive side of the sensor substrate,
- wherein the buffer layer acts as an impact-resistant layer during the bonding step.
Dependencies are inferred from the claim text.