US 6,608,283 B2Granted

Apparatus and method for solder-sealing an active matrix organic light emitting diode

AssigneeeMagin Corporation

InventorsYachin Liu, Amalkumar P. Ghosh, Steven M. Zimmerman, Christian M. Heller

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Abstract

The present invention is directed to an apparatus and method of solder-sealing an active matrix OLED display using a monochromatic solid-state laser beam (1). The solder-sealing apparatus comprises a cover assembly (13) adapted to be positioned over at least one OLED (11) on a substrate (10), a sealing band (12) surrounding each OLED, a chuck assembly (20) with an array of heat sinks (21) that align with the OLEDs, a pick-up assembly (30) with at least one aperture (33), and a flange assembly (132) to which a solder pre-form (133) is secured. The chuck assembly (20) receives, aligns and orients the substrate (10). A vacuum is then applied through each aperture (33) to align and hold the cover assembly (13) in place. The sealing band (12) and solder pre-form (133) are aligned and pressed together by the pick-up assembly (30), and the focused laser beam (1) is projected through the chuck assembly to seal the OLEDs (11) within the cover assembly (13).

Claims56

Dependent claims

An apparatus for sealing at least one organic light emitting diode device located on a substrate with at least one cover assembly, said apparatus comprising:

(a) a chuck assembly for receiving said substrate, wherein said chuck assembly comprises at least one heat sink aligned with said at least one organic light emitting diode device and wherein said at least one organic light emitting diode device is surrounded by a first sealing band and a second sealing band located on said substrate and separated by a gap, wherein said first sealing band is closer to said at least one organic light emitting diode device than said second sealing band;
(b) a pick-up assembly for receiving said at least one cover assembly, comprising:
(i) a base assembly having a bottom surface and a top surface, each of which is parallel to said substrate in said chuck assembly, said base assembly comprising (1) at least one recess in said bottom surface for receiving said at least one cover assembly, (2) at least one aperture through said base assembly from said at least one recess to said top surface through which a vacuum is applied to hold said at least one cover assembly in said at least one recess, and (3) at least one heat sink on said top surface, wherein said at least one cover assembly comprises a face plate having a periphery and a flange assembly around said periphery, said flange assembly having a first portion that is secured to the face plate, a second portion having secured thereto a solder pre-form that is aligned with said first sealing band on said substrate, and an intermediate portion connecting said first and second portions;
and
(ii) a means for applying pressure to said aligned solder pre-form and first sealing band;
and
(c) a laser beam projected through said chuck assembly.

4 more elements

A method for sealing at least one organic light emitting diode device located on a substrate with at least one cover assembly, said method comprising the steps of:

(a) providing said substrate in a chuck assembly, wherein said chuck assembly comprises at least one heat sink aligned with said at least one organic light emitting diode device and wherein said at least one organic light emitting diode device is surrounded by a first sealing band and a second sealing band located on said substrate, wherein said first sealing band and said second sealing band are separated by a gap and said first sealing band is closer to said at least one organic light emitting diode device than said second sealing band;
(b) providing at least one cover assembly in a pick-up assembly, said pick-up assembly comprising:
(i) a base assembly having a bottom surface and a top surface, each of which is parallel to said substrate in said chuck assembly, said base assembly comprising:
(1) at least one recess in said bottom surface for receiving said at least one cover assembly,
(2) at least one aperture through said base assembly from said at least one recess to said top surface through which a vacuum is applied to hold said at least one cover assembly in said at least one recess, and
(3) at least one heat sink on said top surface, wherein said at least one cover assembly comprises a face plate having a periphery and a flange assembly around said periphery, said flange assembly having a first portion that is secured to the face plate, a second portion having secured thereto a solder pre-form that is aligned with said first sealing band on said substrate, and an intermediate portion connecting said first and second portions;
and
(ii) a means for applying pressure to said aligned solder pre-form and first sealing band;
(c) aligning said solder pre-form with said first sealing band;
(d) contacting said solder pre-form and said first sealing band;
(e) applying heat to said solder pre-form and said first sealing band;
and
(f) applying pressure to said aligned and contacted solder pre-form and first sealing band.

10 more elements

A method for sealing at least one organic light emitting diode device located on a substrate with at least one cover assembly, said method comprising:

(a) applying a laser beam through a chuck assembly, wherein said substrate is in said chuck assembly, wherein said chuck assembly comprises at least one heat sink aligned with said at least one organic light emitting diode device and wherein said at least one organic light emitting diode device is surrounded by a first sealing band and a second sealing band located on said substrate, wherein said first sealing band and said second sealing band are separated by a gap and said first sealing band is closer to said at least one organic light emitting diode device than said second sealing band;
and
(b) applying pressure to a solder pre-form in said at least one cover assembly that is aligned with said first sealing band located on said substrate such that said solder pre-form contacts said first sealing band, wherein said at least one cover assembly comprises a face plate having a periphery and a flange assembly around said periphery, said flange assembly having a first portion that is secured to the face plate, a second portion having secured thereto said solder pre-form, and an intermediate portion connecting said first and second portions;
and wherein said at least one cover assembly is in a pick-up assembly, said pick-up assembly comprising
(i) a base assembly having a bottom surface and a top surface, each of which is parallel to said substrate in said chuck assembly, said base assembly comprising:
(1) at least one recess in said bottom surface for receiving said at least one cover assembly,
(2) at least one aperture through said base assembly from said at least one recess to said top surface through which a vacuum is applied to hold said at least one cover assembly in said at least one recess, and
(3) at least one heat sink on said top surface;
and
(ii) a means for applying pressure to said aligned and contacted solder pre-form and first sealing band.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/778,797Filed 8 Feb 2001 · us provisional application
Priority: 8 Feb 2000
Published: US 2001/0048234 A16 Dec 2001
Granted: 19 Aug 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

B23K 26/324
Taking account of the properties of the material involved: involving non-metallic parts
B23K 26/32
Bonding: taking account of the properties of the material involved
H10K 59/8722
Self-supporting sealing arrangements: peripheral sealing arrangements, e.g. adhesives, sealants
B23K 2103/16
Materials to be soldered, welded or cut: composite materials