Direct plane attachment for capacitors
AssigneeSun Microsystems, Inc.
InventorsValerie St. Cyr, Istvan Novak
Life of this patent
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AssigneeSun Microsystems, Inc.
InventorsValerie St. Cyr, Istvan Novak
Estimating the term…
A method of direct plane attachment of capacitors is disclosed. In one embodiment, a printed circuit board (PCB) having a signal layer, a first conductive plane, and a second conductive plane is provided. The signal layer may be the outermost layer of the PCB, while the first conductive layer may be arranged between the signal layer and the second conductive layer. A cavity may be formed in the printed circuit board, wherein the cavity extends from the signal layer down to the first conductive plane. The cavity may be large enough to accommodate one or more capacitors. A first terminal of the capacitor may be attached to the first conductive plane. The second terminal of the capacitor may be mounted within an opening in the first conductive plane. The method may allow a bypass capacitor to be directly coupled to a power or reference plane.
A printed circuit board comprising:
A method for directly attaching a capacitor to a conductive plane of a printed circuit board, the method comprising:
A printed circuit board comprising:
A method for directly attaching a capacitor to conductive planes of a printed circuit board, the method comprising:
Dependencies are inferred from the claim text.