US 6,608,158 B2 · Copolymer resin, preparation thereof, and photoresist using the same

Abstract

The present invention relates to a copolymer resin for a photoresist used in far ultraviolet ray such as KrF or ArF, process for preparation thereof, and photoresist comprising the same resin. The copolymer resin according to the present invention is easily prepared by conventional radical polymerization due to the introduction of mono-methyl cis-5-norbonen-endo-2,3-dicarboxylate unit to a structure of norbornene-maleic anhydride copolymer for photoresist. The resin has high transparency at 193 nm wavelength, provides increased etching resistance and settles the problem of offensive odor occurred in the course of copolymer resin synthesis. Further, as the resin composition can be easily controlled due to the molecular structure, the resin can be manufactured in a large scale.

Claims13

Dependent claims

A process for preparing a copolymer resin of the formula:

wherein
R is tert-butyl, tetrahydropyranyl, tetrahydrofuranyl or ethoxyethyl;
and
the ratio w:x:y:z is (0.1-99%):(0.1-99%):(0.1-99%):(0.1-99%), said process comprising polymerizing a mixture comprising a norbornene derivative of the formula:
2-hydroxyethyl-5-norbornene-2-carboxylate, maleic anhydride and mono-methyl-cis-5-norbonen-endo-2,3-dicarboxylate in the presence of a radical initiator under conditions sufficient to produce the copolymer resin.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/055,674Filed 22 Jan 2002 · division

Priority

KR 97-7741229 Dec 1997

Published

US 2002/0068803 A16 Jun 2002

Granted

19 Aug 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

C08F 232/08
Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double…
C08F 222/06
Anhydrides, e.g. cyclic anhydrides: maleic anhydride
G03F 7/039
Photosensitive materials: macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/0045
Photosensitive materials: with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Copolymer resin, preparation thereof, and photoresist using the same

Life of this patent

Copolymer resin, preparation thereof, and photoresist using the same

Life of this patent

Abstract

Claims13