Hot melt adhesive of cationic polymerizable compound, photoinitiator and phthalate diester
AssigneeSekisui Chemical Co., Ltd.
InventorsTakeo Kuroda, Tsuyoshi Hasegawa, Masanori Matsuda, Takeshi Miyake, Takashi Shinjo
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Abstract
The invention is a reactive hot melt adhesive composition comprising a cationically polymerizable compound, on the average per molecule, having one or more cyclic ether groups such as epoxy groups, a phthalate diester compound expressed by the following formula (2) and a cationic photo-initiator: wherein in the formula (2), R5 indicates (ChH2hO)iH and R6 indicates (CkH2kO)lH or (CkH2kO)lCkH2k+1, provided that h, i, k and l each are an integer of 1 or more. The present invention provides a reactive hot melt adhesive, in which a curing reaction progresses under application of actinic radiation.
Claims2
A reactive hot melt adhesive composition comprising:
- a cationically polymerizable compound, on the average per molecule, having one or more cationically polymerizable reactive groups of a structure of the following formula (1);
- a phthalate diester compound of a structure of the following formula (2);
- and
- a cationic photo-initiator;
- wherein, in the formula (1), R1, R2, R3 and R4 each indicate a hydrogen atom, a methyl group, and ethyl group, an isopropyl group, an isoamyl group or a phenyl group, provided that m and n each are an integer having a value of 0, 1 or 2, and
- wherein, in the formula (2), R5 indicates (ChH2hO)iH and R6 indicates (CkH2kO)1CkH2k+1, provided that h, I, k and l each are an integer having a value of 1 or more.
Dependencies are inferred from the claim text.