Thermoplastic resin composition, molded product using the same and transport member for electric and electronic parts using the same

A thermoplastic resin composition comprising a thermoplastic resin and hollow carbon fibrils dispersed in the thermoplastic resin, wherein

• the thermoplastic resin comprises at least one resin selected from the group consisting of polycarbonates, polyphenylene ethers, polyamides. polyesters and aromatic vinyl compound polymers, and
• the hollow carbon fibrils being present in an amount of 0.1 to 20% by weight based on the total weight of the composition, comprising independent fibrils and agglomerated fibrils, and having such a dispersing condition, when represented by indices based on the measurement of transmission electron microphotograph, that the ratio of the independent fibrils to the agglomerated fibrils lies within the range of 8/92 to 40/60 and the independent fibrils have an average length of 20 to 200 nm.