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US 6,607,949 B2Granted
Method for fabricating polysilicon thin film transistor with improved electrical characteristics
AssigneeLG.Philips LCD Co., Ltd.
InventorsBinn Kim, Hae Yeol Kim, Dae Hyun Nam
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Abstract
A method for fabricating a thin film transistor includes forming a buffer layer on a substrate, forming a first amorphous silicon layer on the buffer layer, forming a plurality of metal clusters on the first amorphous silicon layer, forming a second amorphous silicon layer on the metal clusters including the first amorphous silicon layer, and simultaneously applying a heat-treatment and an electrical field to crystallize the first and the second amorphous silicon layers.
Claims7
A method for fabricating a thin film transistor, the method comprising:
- forming a buffer layer on a substrate;
- forming a first amorphous silicon layer on the buffer layer;
- forming a plurality of metal clusters on the first amorphous silicon layer;
- forming a second amorphous silicon layer on the metal clusters including the first amorphous silicon layer;
- simultaneously applying a heat-treatment and an electrical field to crystallize the first and the second amorphous silicon layers, thereby forming first and second polysilicon layers;
- patterning the first polysilicon layer to form a polysilicon island;
- forming a gate electrode, a source electrode, and a drain electrode;
- and
- removing the second polysilicon layer and the metal clusters from the substrate.
6 more elements
Dependencies are inferred from the claim text.