Micro-electromechanical process for fabrication of integrated multi-frequency communication passive components

A method for fabricating a multi-frequency passive communication integrated circuit comprising the steps of:

• (A) constructing a first set of electrical components on a first substrate by a micro-electromechanical process, said micro-electromechanical process including the steps of:
• (i) depositing at least one layer of material by sputtering, thermal vapor, or electron beam, wherein each layer is deposited at a temperature less than 450° C;
• (ii) curing at least one layer of a polyimide material, wherein each polyimide layer is cured at a temperature between 250° C. and 400° C.;
• (iii) applying at least one copper layer by direct electroplating;
• (iv) planarizing said at least one copper layer as deposited in step (iii) by chemical mechanical polishing, wherein each copper layer is planarized at a temperature of less than 150° C.;
• and
• (iv) applying at least one ceramic layer by plasma-enhanced chemical vapor deposition, wherein each ceramic layer is applied at a temperature of between 300° C and 400° C;
• (B) constructing a second set of electrical components on a second substrate;
• (C) forming in said second substrate at least one via hole and a plurality of cavities;
• (D) depositing a metal layer on an inner surface of each of said plurality of cavities;
• (E) adjoining said first substrate and said second substrate such that said first set of electrical components is positioned within said plurality of cavities;
• and
• (F) electrically coupling a circuit constructed from said second set of electrical components to a circuit constructed from said first set of electrical components through said at least one via hole.