Metal film bonded body, bonding agent layer and bonding agent

An adhesive layer formed on a substrate and having a roughened surface, wherein said layer is formed by dispersing a decomposition-removable granular substance into a cured heat-resistant resin matrix comprised of a resin composite comprising a thermoplastic resin and at least one resin selected from a thermosetting resin and a photosensitive resin,

• wherein said matrix comprises 15 to 50 wt. % of said thermoplastic resin, and
• wherein said decomposition-removable granular substance is emulsion-polymerized amino resin having a low cross-linking degree comprising melamine resin, urea resin and guanamine resin,
• wherein said thermosetting resin comprises at least one functional group substituted by a photosensitive group.

An adhesive layer formed on a substrate and having a roughened surface, wherein said layer is formed by dispersing one dissolution-removable granular substance selected from metal particles, resin particles soluble in an alkali and resin particles soluble in an organic solvent, into a cured heat-resistant resin matrix comprised of a resin composite comprising a thermoplastic resin and at least one resin selected from a thermosetting resin and a photosensitive resin,

• wherein said matrix comprises 15 to 50 wt. % of said thermoplastic resin, and
• wherein said thermosetting resin has at least one functional group substituted by a photosensitive group.

An adhesive layer formed on a substrate and having a roughened surface, wherein said layer is formed by dispersing a dissolution-removable resin into a cured heat-resistant resin matrix being a resin composite comprising a thermoplastic resin and at least one resin selected from a thermosetting resin and a photosensitive resin in the form of lands to form a sea-land structure,

• wherein said matrix comprises 15 to 50 wt. % of said thermoplastic resin, and
• wherein said dissolution-removable resin is at least one selected from the group consisting of metal particles, resin particles soluble in alkali and resin particles soluble in an organic solvent, and
• wherein said thermosetting resin has at least one functional group substituted by a photosensitive group.

An adhesive obtained by dispersing a decomposition-removable particulate substance into an uncured heat-resistant resin matrix, in which the heat-resistant resin matrix comprises a resin mixture comprising a thermoplastic resin and at least one resin selected from a thermosetting resin and a photosensitive resin,

• wherein said matrix comprises 15 to 50 wt. % of said thermoplastic resin, and
• wherein said decomposition-removable particulate substance is emulsion-polymerized amino resin having a low cross-linking degree comprising melamine resin, urea resin and guanamine resin,
• wherein said thermosetting resin has at least one functional group substituted by a photosensitive group.

An adhesive obtained by dispersing at least one dissolution-removable granular substance selected from the group consisting of metal particles, resin particles soluble in an alkali and resin particles soluble in an organic solvent into an uncured heat-resistant resin matrix, in which the heat-resistant resin matrix is a resin mixture comprising a thermoplastic resin and at least one resin selected from a thermosetting resin and a photosensitive resin,

• wherein said matrix comprises 15 to 50 wt. % of said thermoplastic resin, and
• wherein said thermosetting resin has at least one functional group substituted by a photosensitive group.

An adhesive obtained by dispersing into an uncured heat-resistant resin matrix a resin solution not miscible with the matrix before curing and dissolution removable after curing, wherein the heat-resistant resin matrix comprises a resin mixture of a thermoplastic resin and at least one resin selected from a thermosetting resin and a photosensitive resin,

• wherein said matrix comprises 15 to 50 wt. % of said thermoplastic resin, and
• wherein said resin solution comprises epoxy group terminal silicon resin solution, and
• wherein said thermosetting resin has at least one functional group substituted by a photosensitive group.