US 6,607,780 B1 · Process of forming a ceramic structure using a support sheet

Abstract

The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.

Claims33

Dependent claims

A method for fabricating a ceramic substrate comprising the steps of:

(a) forming at least one opening in a support sheet using a photolithography technique,
(b) filling said at least one opening with at least one non-conductive paste,
(c) placing at least one green sheet on said support sheet and said non-conductive paste, wherein at least a portion of said non-conductive paste in said support sheet is anchored to at least a portion of said green sheet,
(d) opening at least one through-hole through said green sheet and said non-conductive paste, such that at least a portion of said non-conductive paste remains adhered to at least a portion of the side-wall of said at least one opening in said support sheet, and at least a portion of said non-conductive paste remains adhered to at least a portion of said green sheet, and
(e) filling said through-hole with at least one conductive paste.

2 more elements

A method for fabricating a ceramic substrate comprising the steps of:

forming at least one first opening in a first support sheet and at least one second opening in a second support sheet, using a photolithography technique,
filling said first and second openings with at least one non-conductive paste,
placing at least one first green sheet on said first support sheet and at least one second green sheet on said second support sheet, wherein at least a portion of said non-conductive paste in said first support sheet is anchored to at least a portion of said first green sheet, and at least a portion of said non-conductive paste in said second support sheet is anchored to at least a portion of said second green sheet,
opening at least one first through-hole through said first green sheet and said non-conductive paste and at least one second through-hole through said second green sheet and said non-conductive paste, such that at least a portion of said non-conductive paste remains adhered to at least a portion of the side-wall of said first and second openings, and at least a portion of said non-conductive paste remains adhered to at least a portion of said first and second green sheets,
filling said first and second through-holes with at least one conductive paste, and
joining said first green sheet to said second green sheet.

3 more elements

Dependencies are inferred from the claim text.

Process of forming a ceramic structure using a support sheet

Life of this patent

Process of forming a ceramic structure using a support sheet

Life of this patent

Abstract

Claims33