Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnect
AssigneeSamsung Electronics Co., Ltd.
InventorsSun-jung Lee, Kyu-hwan Chang, Hyeon-deok Lee
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Abstract
A copper-plating electrolyte includes an aqueous copper salt solution, a water-soluble β-naphtholethoxylate compound having the formula wherein n is an integer from 10 to 24, one selected from the group consisting of a disulfide having the formula XO3S(CH2)3SS(CH2)3SOX3 and a water-soluble mercaptopropanesulfonic acid or salt thereof having the formula HS(CH2)3SO3X, where X is sodium, potassium, or hydrogen, a water-soluble polyethylene glycol having a molecular weight ranging from about 4,600 to about 10,000, and a water-soluble polyvinylpyrrolidone having a molecular weight ranging from about 10,000 to about 1,300,000.
Claims19
A copper-plating electrolyte comprising:
- (a) an aqueous copper salt solution;
- (b) a water-soluble β-naphtholethoxylate compound having the formula
- wherein n is an integer from to 10 to 24;
- (c) one selected from the group consisting of a disulfide having the formula XO3S(CH2)3SS(CH2)3SOX3 and a water-soluble mercaptopropanesulfonic acid or salt thereof having the formula HS(CH2)3SO3X, wherein X is sodium, potassium, or hydrogen;
- (d) a water-soluble polyethylene glycol having a molecular weight ranging from about 4,600 to about 10,000;
- and
- (e) a water-soluble polyvinylpyrrolidone having a molecular weight ranging from about 10,000 to about 1,300,000.
An electroplating method for forming a copper interconnect of a semiconductor device, the electroplating method comprising the steps of:
- (i) forming a predetermined pattern containing a trench or via hole on a semiconductor substrate;
- and
- (ii) electroplating the semiconductor substrate having the predetermined pattern with a copper-plating electrolyte comprising
- (a) an aqueous copper salt solution,
- (b) a water-soluble β-naphtholethoxylate compound having the formula
- wherein n is an integer from 10 to 24,
- (c) one selected from the group consisting of a disulfide having the formula XO3S(CH2)3SS(CH2)3SOX3 and a water-soluble mercaptopropanesulfonic acid or salt thereof having the formula HS(CH2)3SO3X, where X is sodium, potassium, or hydrogen,
- (d) a water-soluble polyethylene glycol having a molecular weight ranging from about 4,600 to about 10,000, and
- (e) a water-soluble polyvinylpyrrolidone having a molecular weight ranging from about 10,000 to about 1,300,000.
Dependencies are inferred from the claim text.