Pressurized membrane platen design for improving performance in CMP applications
AssigneeLam Research Corporation
InventorsRod Kistler, John Boyd, Alek Owczarz
Life of this patent
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Abstract
An invention is disclosed for improved performance in a CMP process using a pressurized membrane as a replacement for a platen air bearing. In one embodiment, a platen for improving performance in CMP applications is disclosed. The platen includes a membrane disposed above the platen, and a plurality of annular bladders disposed below the membrane, wherein the annular bladders are capable of exerting force on the membrane. In this manner, zonal control is provided during the CMP process.
Claims29
A platen for improving performance in chemical mechanical polishing (CMP) applications, comprising:
- a membrane disposed above the platen;
- and
- a plurality of annular bladders disposed below the membrane, wherein the plurality of annular bladders is capable of exerting force on the membrane.
A system for improving performance in chemical mechanical polishing (CMP) applications, comprising:
- a wafer head capable of carrying a wafer;
- a polishing belt disposed below the wafer head;
- and
- a platen having a membrane positioned below the polishing belt, the platen further including annular bladders disposed below the membrane, wherein the annular bladders are capable of exerting force on the membrane.
A method for improving performance in chemical mechanical polishing (CMP) applications, comprising the operations of:
- providing a platen having a membrane positioned above the platen, the platen further including annular bladders disposed below the membrane, wherein the annular bladders are capable of exerting force on the membrane;
- applying a wafer to a polishing belt disposed above the platen;
- and
- stabilizing the polishing belt utilizing the platen, wherein the membrane applies specific forces to the polishing belt utilizing the annular bladders.
A platen for improving performance in chemical mechanical polishing (CMP) applications, comprising:
- a membrane comprising a soft and flexible material attached to the platen, the membrane being disposed above the platen;
- and
- a plurality of annular bladders disposed below the membrane, wherein each annular bladder of the plurality of annular bladders can be individually pressurized to exert force against the membrane.
A system for improving performance in chemical mechanical polishing (CMP) applications, comprising:
- a wafer head capable of carrying a wafer;
- a polishing belt disposed below the wafer head;
- and
- a platen having a membrane comprising a soft and flexible material attached to the platen, the platen being positioned below the polishing belt, the platen further including a plurality of annular bladders disposed below the membrane, wherein each annular bladder of the plurality of annular bladders can be individually pressurized to exert force against the membrane,
- wherein the force exerted against the membrane is transferred to the polishing belt to provide zonal control during a CMP process.
A method for improving performance in chemical mechanical polishing (CMP) applications, comprising the operations of:
- providing a platen having a membrane positioned above the platen, the platen further including annular bladders disposed below the membrane, wherein the annular bladders are capable of exerting force on the membrane;
- applying a wafer to a polishing belt disposed above the platen;
- stabilizing the polishing belt utilizing the platen, wherein the membrane applies specific forces to the polishing belt utilizing the annular bladders;
- and
- pressurizing individual annular bladders to provide force to specific areas of the membrane.
Dependencies are inferred from the claim text.