Low profile RF connector assembly

An electrical system comprising:

• a printed circuit board (PCB) having a top face and a cutout defined therein;
• a first connector located in the cutout of the PCB and including an insulative base, an outer ground contact and an inner signal contact respectively insert molded with the insulative base, the signal contact enclosed by said ground contact, the ground contact having a mating portion and a grounding pad extending from a bottom edge of the mating portion, the signal contact located in the ground contact and having a center pin and a signal pad extending from a bottom edge of the center pin, the grounding pad and the signal pad being soldered to the top face of the PCB;
• and
• a second connector electically connecting with the ground and signal contacts of the first connector;
• wherein
• the grounding pad of the ground contact has a first connecting portion received in the insulative base, a first bending portion extending upward from the first connecting portion and a first soldering portion extending outwardly from the first bending portion and soldered to a top surface of the PCB;
• wherein
• a bottom surface of the first connecting portion of the ground contact is coplanar with a bottom surface of the insulative base;
• wherein
• the mating portion of the ground contact has a mating groove defined at a bottom portion thereof;
• wherein
• the signal pad of the signal contact has a second connecting portion received in the insulative base, a second bending portion extending upwardly from the second connecting portion and a second soldering portion extending outwardly from the second bending portion and soldered to the top surface of the PCB.