Fiber-optic modules with shielded housing/covers having mixed finger types
AssigneeE20 Communications, Inc.
InventorsEdwin Dair, Wenbin Jiang, Cheng Ping Wei, Yong Peng Sim
Life of this patent
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AssigneeE20 Communications, Inc.
InventorsEdwin Dair, Wenbin Jiang, Cheng Ping Wei, Yong Peng Sim
Estimating the term…
A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers and backward fingers. The forward fingers provide an EMI seal around an opening in a bezel, face-plate, backplate, wall, or panel of a host system and thereby can ground the housing/shielding unit to a chassis ground. The backward fingers can contact host tabs of the host system and can also thereby ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and can be grounded as well through a host system faceplate or otherwise to the chassis ground.
A fiber-optic module comprising:
A fiber-optic module comprising:
A system for providing electromagnetic interference (EMI) shielding, the system comprising:
A fiber-optic module comprising:
A fiber-optic module comprising:
A fiber-optic module comprising:
A fiber-optic module comprising:
Dependencies are inferred from the claim text.