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US 6,607,264 B1Granted
Fluid controlling apparatus
AssigneeHewlett-Packard Development Company, L.P.
InventorsJulie J. Cox, John A. Compton
Life of this patent
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Abstract
A fluid controlling apparatus having a multi-layer structure that includes a top layer having a yield strength of less than about 500 megapascals, a middle layer having a yield strength of greater than about 1000 megapascals, and a bottom layer having a yield strength of less than about 500 megapascals.
Claims35
A fluid controlling apparatus comprising:
- a thin film heater resistor portion that includes a plurality of heater resistors;
- and
- a multi-layer structure disposed over the heater resistors and including a top layer having a yield strength of less than about 500 megapascals, a middle layer having a yield strength of greater than about 1000 megapascals, and a bottom layer having a yield strength of less than about 500 megapascals.
A fluid drop emitting apparatus comprising:
- a thin film heater resistor portion that includes a plurality of heater resistors;
- a fluid barrier layer disposed on the thin film stack;
- respective fluid chambers formed in the barrier layer over respective heater resistors;
- respective nozzles disposed over respective fluid chambers and heater resistors;
- and
- a multi-layer structure underlying the fluid chambers and including a top layer that comprises a refractory metal, a middle layer having a yield strength greater than about 1000 megapascals, and a bottom layer that comprises a refractory-metal, wherein;
- the top layer comprises tantalum;
- the middle layer comprises a cobalt based alloy;
- and
- the bottom layer comprises tantalum.
7 more elements
A fluid drop emitting apparatus comprising:
- a thin film heater resistor portion that includes a plurality of heater resistors;
- a fluid barrier layer disposed on the thin film stack;
- respective fluid chambers formed in the barrier layer over respective heater resistors;
- respective nozzles disposed over respective fluid chambers and heater resistors;
- and
- a multi-layer structure underlying the fluid chambers and including a top layer that comprises a refractory metal, a middle layer having a yield strength greater than about 1000 megapascals, and a bottom layer that comprises a refractory metal, wherein;
- the top layer comprises tantalum;
- the middle layer comprises silicon carbide;
- and
- the bottom layer comprises tantalum.
7 more elements
A method of making a thin film device comprising:
- forming a plurality of thin film layers;
- forming on the plurality of thin film layers a first passivation layer having a yield strength that is less than about 500 megapascals;
- forming on the first passivation layer a second passivation layer layer having a yield strength that is greater than about 1000 megapascals;
- and
- forming on the second passivation layer a third passivation layer having a yield strength that is less than about 500 megapascals.
2 more elements
Dependencies are inferred from the claim text.