Module for IC card, IC card, and method for manufacturing module for IC card
AssigneeRohm Co., Ltd.
InventorsMinoru Hirai, Shigeyuki Ueda, Osamu Miyata, Tomoharu Horio
Life of this patent
Estimating the term…
Abstract
An IC-card module (A) to be incorporated in an IC-card (B) includes a substrate (1), an IC chip (2) mounted on the substrate, and a protective member (4) bonded to the substrate (1) to cover the IC chip (2). A clearance (S) is provided between the protective member (4) and the IC chip (2) for avoiding direct contact of the protective member (4) with the IC chip (2). The clearance (S) is loaded with a filler (6) having a low modulus of elasticity, as required. The protective member (4) includes a reinforcing member (8).
Claims25
An IC-card comprising a card member and an IC-card module accommodated within the card member, the IC-card module comprising:
- a substrate smaller than the card member, an IC chip mounted on the substrate in contact therewith, and a protective member mounted on the substrate for enclosing the IC chip, the protective member being separate from the card member;
- wherein the protective member comprises an accommodating space defined by inner wall surfaces, the IC chip being received in the accommodating space and spaced from the inner wall surfaces of the protective member.
A method of making an IC-card module comprising:
- a first step of covering an IC chip mounted on a substrate with a covering material;
- a second step of packaging the IC chip in a resin package over the covering material;
- wherein the second step includes liquefying or gasifying the covering material for penetration into the resin-package before the resin-package is cured so that an accommodating space larger than the IC chip is formed for housing the IC chip, the accommodating space being unoccupied by resin.
An IC-card module comprising:
- a substrate,
- conductors formed on the substrate;
- an IC chip mounted on the substrate in electrical connection to the conductors;
- a protective member mounted on the substrate for enclosing the IC chip;
- and
- a reinforcing member provided on the protective member and spaced from the conductors, the reinforcing member being harder than the protective member for reinforcing the protective member around the IC chip, the reinforcing member being located closer to the IC chip than a peripheral portion of the protective member.
An IC-card comprising a card member and an IC-card module accommodated within the card member, the IC-card module comprising:
- a substrate smaller than the card member;
- conductors formed on the substrate;
- an IC chip mounted on the substrate in contact therewith for electrical connection to the conductors;
- a protective member mounted on the substrate for enclosing the IC chip, the protective member being provided separately from the card member;
- and a reinforcing member provided on the protective member and spaced from the conductors, the reinforcing member being harder than the protective member for reinforcing the protective member around the IC chip.
Dependencies are inferred from the claim text.