Apparatus and method for ball release
AssigneeASM Assembly Automation Ltd.
InventorsChi Wah Cheng, Ping Kong Joseph Choy, Ping Chun Benson Chong, Ka Kin Wong, Chi Fung Chan
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Abstract
There is disclosed a method and apparatus for ensuring release of objects such as solder balls from a pick head in a transfer and placement apparatus, comprising causing said pick head to vibrate by applying a vibration signal to said pick head over a range of frequencies. The range of frequencies is chosen such that it bounds the resonant frequencies of the pick head which may be calculated by computer simulation.
Claims7
A method for ensuring release of objects from a pick head in a transfer and placement apparatus, comprising causing said pick head to vibrate by generating a random signal over a range of frequencies and applying said random signal to a vibration means secured to said pick head.
A method for ensuring release of solder balls from a ball pick head in a ball transfer and placement apparatus, comprising causing said pick head to vibrate by applying a random vibration signal to said pick head over a range of frequencies.
A method for ensuring release of objects from a pick head in a transfer and placement apparatus, comprising the steps of:
- (d) analysing said pick head to identify the resonant frequencies of said pick head,
- (e) selecting first and second frequencies defining a range of frequencies that include said resonant frequencies, and
- (f) applying random vibrations to said pick head over said range of frequencies.
Apparatus for ensuring release of objects from a pick head in a transfer and placement apparatus, comprising:
- signal generating means for generating a random signal between first and second frequencies, vibration generating means for causing vibration of said pick head, said vibration generating means receiving said random signal as an input signal.
Dependencies are inferred from the claim text.