Solder ball attaching system and method
AssigneeSamsung Electronics Co., Ltd.
InventorsJu-Il Kang, Hee-Sang Yang
Life of this patent
Estimating the term…
Abstract
The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.
Claims19
A system for attaching solder balls, the system comprising:
- a base body;
- a base frame unloader for unloading base frames from containers mounted on the base body to seat the solder balls on solder ball pads of the base frames;
- a solder ball seating device mounted on the base body, the solder ball seating device receiving the unloaded base frames from the base frame unloader, fixing the base frames in a designated position, coating with flux, seating the solder balls, sorting the base frames and storing some of the base frames;
- a reflow device mounted on the base body, the reflow device loading the sorted and stored base frames and melting and cooling the solder balls;
- a cleaning device mounted on the base body, the cleaning device receiving the loaded base frames from the reflow device, cleaning the flux remaining on the solder ball pads and drying the base frames;
- and
- a base frame loader mounted on the base body, the base frame loader sorting the base frames transferred from the cleaning device and storing some of the base frames.
Dependencies are inferred from the claim text.