Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKenichiro Suetsugu, Shunji Hibino, Yukio Maeda, Shoshi Kabashima, Mikiya Nakata
Life of this patent
Estimating the term…
Abstract
There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained by utilizing a differential thermal analysis method, and thereby a quality of the lead-free solder material used for a flow soldering process is estimated based on the obtained differential thermal analysis curve.
Claims19
A method for detecting existence of an impurity in a lead-free solder material while conducting a flow soldering process with the lead-free solder material, which method comprises obtaining a differential thermal analysis curve of a sample of the lead-free solder material relative to a reference material by utilizing a differential thermal analysis method.
A process for flow soldering using a lead-free solder material, which process comprises:
- obtaining a sample of the lead-free solder material in a solder bath of a flow soldering apparatus;
- and
- obtaining a differential thermal analysis curve of the sample of the lead-free solder material relative to a reference material by utilizing a differential thermal analysis method, and thereby estimating a quality of the lead-free solder material based on the differential thermal analysis curve.
Dependencies are inferred from the claim text.