Component recognizing method and apparatus

A component recognizing apparatus for recognizing leads on a mounting surface of an electronic component, said apparatus comprising:

• an illumination unit operable to apply light to the leads;
• a height detecting section operable to detect positions of the leads on the basis of light that is applied from said illumination unit and reflected from the leads, said height detecting section comprising a 3D sensor;
• a noise removing section operable to limit a region to be measured by said height detection section so that light reflected from objects behind or near the leads is excluded from the region;
• and
• a processing section operable to process light reflected from the region.

An electronic component position detection method comprising:

• capturing luminance image data of a surface of an electronic component;
• capturing height image data, via a 3D sensor, of the surface of the electronic component;
• and
• processing the luminance image data to detect a two-dimensional position of the electronic component or processing the height image data to detect a three-dimensional position of the electronic component.

A component mounting method for transporting an electronic component from a component supply section to a board and mounting the electronic component onto the board, said method comprising:

• capturing luminance image data of a surface of an electronic component;
• capturing height image data, via a 3D sensor, of the surface of the electronic component;
• selecting one of the luminance image data or the height image data;
• processing the luminance image data to detect a two-dimensional position of the electronic component when the luminance image data is selected or processing the height image data to detect a three-dimensional position of the electronic component when the height image data is selected;
• transporting the electronic component from the component supply section to the board;
• and
• mounting the electronic component onto the board based on the processed image data.

A component recognizing method comprising;

• capturing, as two-dimensional height image data via a height detection sensor comprising a 3D sensor, a height image of a bottom portion of an electronic component having a plurality of hemispherical bump electrodes disposed thereon;
• obtaining and processing height image data of the bump electrodes relative to a reference surface and located in a direction perpendicular to the reference surface, thereby extracting individual bump electrodes from the height image data;
• and
• detecting a volume of an extracted individual bump electrode by summing height image data of an extracted individual bump electrode.

A component recognizing method comprising:

• capturing, as two-dimensional height image data via a height detection sensor comprising a 3D sensor, a height image of a bottom portion of an electronic component having a plurality of hemispherical bump electrodes disposed thereon;
• obtaining and processing height image data of the bump electrodes relative to a reference surface and located in a direction perpendicular to the reference surface, thereby extracting individual bump electrodes from the height image data;
• and
• detecting a shape of an extracted individual bump electrode by extracting outer shape data from the height image data of the extracted individual bump electrode.