Optical fiber interconnect having offset ends with reduced tensile stress and fabrication method
AssigneeLucent Technologies Inc.
InventorEphraim Suhir
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Abstract
A method of fabricating a structure comprising an optical fiber interconnect rigidly clamped within an enclosure wherein ends of the interconnect are offset. The method comprises selecting an enclosure material such that its coefficient of thermal expansion leads, during cooling, to a compressive force that minimizes tensile stress in the interconnect. An optical fiber interconnect structure and a semiconductor device fabricated according to the method are also disclosed.
Claims17
A method of fabricating a structure comprising an optical fiber interconnect rigidly clamped within an enclosure wherein ends of the interconnect are offset, the method comprising:
- selecting an enclosure material such that its coefficient of thermal expansion leads, during cooling, to a compressive force on the interconnect that minimizes tensile stress in the interconnect.
A structure comprising an optical fiber interconnect rigidly clamped within an enclosure, the optical fiber interconnect having ends offset, wherein the enclosure material has a coefficient of thermal expansion such that a compressive force on the interconnect caused by cooling the structure minimizes the maximum tensile stress in the interconnect.
A structure comprising an optical fiber interconnect having ends rigidly clamped within an enclosure, the ends of the interconnect being offset, wherein the enclosure material has a coefficient of thermal expansion such that an axial compression of the interconnect caused by cooling the structure minimizes the maximum tensile stress in the interconnect.
Dependencies are inferred from the claim text.