An electronic component formed by connecting a display module with a printed substrate by means of a connection structure for connecting a display module to a printed substrate, said display module including a display panel connected with a semiconductor device having a semiconductor chip mounted on a flexible wiring substrate, said connection structure being arranged such that:
- said display module is fixed to a housing member in a folded state with respective rear surfaces of said semiconductor device and said display panel facing each other;
- a three-sided frame that holds the display panel is formed on the housing member;
- a protruding electrode is formed on said semiconductor device;
- said display module is fixed to said printed substrate by means of a holding member attached to said housing member, said holding member supporting said printed substrate in engagement therewith;
- and
- said protruding electrode formed on said semiconductor device is in contact with a connection terminal provided on said printed substrate corresponding to said protruding electrode.