Device and method for testing integrated circuit dice in an integrated circuit module
AssigneeMicron Technology, Inc.
InventorsWarren M Farnworth, James M. Wark, Eric S. Nelson, Kevin G. Duesman
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AssigneeMicron Technology, Inc.
InventorsWarren M Farnworth, James M. Wark, Eric S. Nelson, Kevin G. Duesman
Estimating the term…
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements' addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the retested dice, and evaluating the response signals to confirm all repairs.
A switching apparatus for switching first and second voltages to a function circuit in at least one integrated circuit die having at least one external communication terminal, the at least one integrated circuit die being provided in a module having a module terminal for receiving the first voltage from circuitry external to the module, the switching apparatus comprising.
An integrated circuit die comprising:
An integrated circuit module comprising:
An integrated circuit module substrate attached to at least one integrated circuit die and having an external communication terminal, the at least one integrated circuit die entering a test mode in response to receiving a test operation signal through its external communication terminal and entering an operational mode in response to receiving a regular operation signal through its external communication terminal, the integrated circuit module substrate comprising:
An integrated circuit module comprising:
An integrated circuit module substrate attached to one or more integrated circuit dice, each integrated circuit die having a plurality of external communication terminals, the integrated circuit module substrate comprising:
A method for initiating a first mode and a second mode in a function circuit in each of one or more integrated circuit dice in an integrated circuit module having a module terminal, the function circuit being of the type to enter the first and second modes in response to receiving respective first mode initiate and second mode initiate signals, each integrated circuit die of the one or more integrated circuit dice including one or more external communication terminals to receive the first mode initiate signal, the method comprising:
Dependencies are inferred from the claim text.