Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size
AssigneeIntel Corporation
InventorSteven R. Eskildsen
Life of this patent
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Abstract
Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size. A lower die has keep out areas on its top surface. The keep out areas correspond to two adjacent edges of the lower die. The lower die has bond pads within the keep out areas. An upper die is stacked on the top surface of the lower die such that the bond pads within the keep out areas of the lower die are exposed to accept wire bonds. The configuration of the keep out areas next to adjacent edges of the lower die thus provides flexibility in the design of stacked chip packages because the size of the upper die is not limited by the bond pad configuration of the lower die.
Claims11
An integrated circuit device comprising:
- a lower die having a top surface and a bottom surface, the top surface facing away from a substrate, only and two adjacent keep out areas on the top surface, the keep out areas being next to two adjacent bonding edges of the lower die, the lower die further including at least one non-bonding edge area;
- and
- an upper die having one or more bonding edges stacked directly on the lower die such that a bottom surface of the upper die is adjacent to the top surface of the lower die, and such that a least one of the one or more bonding edges of the upper die is oriented toward at least one of the two adjacent bonding edges of the lower die, and such that the two adjacent keep out areas are exposed to accept wire bonds.
An integrated circuit device comprising:
- a lower die having a top surface and a bottom surface, the top surface facing away from a substrate, and keep out areas on the top surface, the keep out areas being next to only two adjacent edges of the lower die, the lower die having bond pads only within the keep out areas;
- and
- an upper die stacked directly on the top surface of the lower die such that a bottom surface of the upper die is adjacent to the top surface of the lower die to avoid the keep out areas such that the bond pads of the lower die are exposed to accept bond wires.
Dependencies are inferred from the claim text.