Dielectric for plasma display panel and composition thereof
AssigneeLG Electronics Inc.
InventorYoon Kwan Lee
Life of this patent
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Abstract
An upper dielectric layer in a plasma display panel that is capable of enlarging an insulation intensity as well as improving a dielectric constant. In the upper dielectric layer, a ferrodielectric thin film and a dielectric thick film are provided. Since the upper dielectric layer uses a ferrodielectric thin film with a high temperature stability made by a vacuum vapor deposition technique, it can minimize a chemical reaction to electrodes and a generation of bubble to keep a stable discharge characteristic. Also, it can enlarge a capacitance value to reduce a discharge voltage.
Claims26
An upper dielectric layer in a plasma display panel, comprising:
- a first ferrodielectric thin film formed on an upper substrate provided with an electrode pair;
- and
- a dielectric thick film formed on the first ferrodielectric thin film.
A process of fabricating an upper dielectric layer in a plasma display panel, comprising:
- forming an upper dielectric layer on an upper substrate with a pair of sustaining electrodes facing a lower substrate, wherein the forming of the upper dielectric layer comprises:
- forming a first ferrodielectric thin film on the upper substrate provided with the pair of sustaining electrodes using a vacuum vapor deposition technique;
- and
- forming a dielectric thick film on the first ferrodielectric thin film on the side opposite from the upper substrate using a screen printing technique.
A dielectric composition for a lower dielectric layer and a barrier rib in a plasma display panel, comprising:
- a parent glass;
- and
- a dielectric composition comprising a first filler comprising TiO2 and a second filler containing a phosphorous (P) element.
A plasma display panel comprising:
- a lower substrate with an address electrode;
- an upper substrate with a pair of sustaining electrodes, wherein the pair of sustaining electrodes are parallel to each other and perpendicular to the address electrode, and wherein the upper and lower substrates face each other defining a space therebetween;
- a plurality of barrier ribs on the upper electrode substrate facing the lower substrate;
- and
- an upper dielectric layer formed on the upper substrate facing the lower substrate, wherein the upper dielectric layer comprises a first dielectric thin film with a high capacitance value and a dielectric constant of more than 1000 formed on the sustaining electrodes and a dielectric thick film formed on the first dielectric thin film.
Dependencies are inferred from the claim text.