Circuit carrier, in particular printed circuit board
AssigneeSiemens Aktiengesellschaft
InventorsHelmut Dörfler, Heiko Mueller, Sebastian Raith
Life of this patent
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Abstract
A circuit carrier (2) (printed circuit board 2) has two metallic outer layers (13, 14) and at least one metallic intermediate layer (11, 12). Insulating layers (8, 9) are arranged between the outer layers (13, 14) and the intermediate layer (11, 12). A component (3, 5) to be cooled and a cooling element (6, 7) are arranged on the outer layers (13, 14). The cooling element (6, 7) is thermally coupled to the component (3, 5) to be cooled via a heat conducting path. The heat conducting path runs partly in the intermediate layer (11, 12). Heat is transferred transversely in said path.
Claims15
A circuit carrier comprising a plurality of metallic outer layers and at least one metallic intermediate layer further comprising a plurality of insulating layers being arranged between the outer layers and the intermediate layer;
- at least one component to be cooled being arranged on at least one of the outer layers, and at least one cooling element being arranged on at least one of the outer layers which said cooling element is thermally coupled to the component to be cooled via at least one heat conducting path, wherein the heat conducting path runs partly in the intermediate layer with heat being transferred transversely in the intermediate layer.
Dependencies are inferred from the claim text.