Photovoltaic device and a method of manufacturing thereof
AssigneeSanyo Electric Co., Ltd.
InventorsNobuo Hanehira, Masayoshi Maeba, Toshihiro Nomura
Life of this patent
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Abstract
A photovoltaic device including a photovoltaic module disposed on or above an insulating substrate 10, which is provided with holes 10a, 10d for receiving conducting paste terminals 50a, 50d of the module formed on the substrate 10. A plurality of conducting materials 52 are connected electrically with the conducting paste terminals 50a, 50d, and a protective resin film 82 is provided to protect the terminals. The protective resin film 82 has openings at positions corresponding to the conducting materials 52, and the openings are larger than the topside shape of the conducting materials 52. The conducting materials are disposed inside of the openings.
Claims8
A photovoltaic device comprising:
- an insulating substrate defining at least one hole;
- a photovoltaic module disposed on or over said insulating substrate, said photovoltaic module having an output terminal;
- a conducting material formed of conducting paste disposed in the hole of said insulating substrate, said conducting material being electrically connected with the output terminal of the photovoltaic module, said conducting material being extended to a backside of the substrate so that said conducting material includes a backside portion;
- and
- a protective layer covering the backside of said substrate and defining an opening, wherein the opening is aligned with the hole, and the opening is larger than the backside portion of the conducting material.
A method of manufacturing a photovoltaic device, the method comprising:
- forming a hole in an insulating substrate for electrically connecting with an output terminal of a photovoltaic module disposed on or above the insulating substrate;
- forming a conducting material to electrically connect the output terminal of the photovoltaic module, wherein the conducting material is formed of conducting paste, and wherein the conducting material is provided in the hole and on a backside of the substrate;
- and
- forming a protective layer on the backside of the substrate including forming an opening located at a position corresponding to the location of the conducting material on the backside of the substrate, wherein the opening is larger than the conducting material on the backside of the substrate.
Dependencies are inferred from the claim text.