Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance
AssigneeIntel Corporation
InventorsPaul H. Wermer, Brian Kaiser
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Abstract
Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as an organic polymer or an organic polymer mixture. Embodiments of the present invention also include forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and providing an embedded capacitor to reduce loop inductance.
Claims27
A method of forming a self-aligned through-via-in-via structure in an organic substrate material, comprising:
- forming a first conductive layer on the sidewall of a through-via in the organic substrate material;
- electrocoating an organic dielectric layer over the formed first conductive layer such that the formed dielectric layer leaves a portion of the through-via unfilled;
- and
- forming within the unfilled portion of the through-via a second conductive layer such that the dielectric layer provides a low loop inductance value between the first conductive layer and the second conductive layer.
A method of forming an organic dielectric layer in a self-aligned through-via-in-via structure, comprising:
- forming a first electrode layer on the sidewall of a through-via in an organic substrate material;
- forming an organic dielectric layer over the first electrode layer such that the thickness of the formed organic dielectric layer is less than about 30 microns such that the dielectric layer leaves a portion of the through-via unfilled;
- and
- filling the unfilled portion of the through-via with a second electrode layer.
A method comprising:
- forming a first conductive layer on a multilayered organic substrate material;
- electrocoating an organic dielectric layer over the first conductive layer;
- and
- forming a second conductive layer over the organic dielectric layer.
A method, comprising:
- forming a first electrode layer, by forming a layer of conductive material over the sidewall of a through-via;
- electrocoating an organic dielectric layer over the first electrode layer such that a portion of the through-via is left unfilled;
- and
- forming a second electrode layer, by filling the remaining unfilled portion of the through-via by a conductive material.
A method comprising:
- forming a first conductive layer on the sidewall of a through-via in a substrate;
- electrocoating an organic dielectric layer over the first conductive layer, leaving a portion of the through-via unfilled;
- and
- forming within the unfilled portion of the through-via a second conductive layer.
Dependencies are inferred from the claim text.