Wirebond passivation pad connection using heated capillary

A method of forming a wirebond connection to a corrosion susceptible metal wiring, said method comprising:

• forming an insulative structure overlaying said corrosion susceptible metal wiring;
• defining a via through said insulative structure above a portion of said corrosion susceptible metal leaving a protective barrier on said portion of said corrosion susceptible metal;
• and
• attaching a wirebond material to said portion of said corrosion susceptible metal with a heated capillary, said attaching including a preliminary process of exposing said portion of said corrosion susceptible metal, said attaching completely covering said portion of said corrosion susceptible metal, wherein said preliminary process of at least partially exposing comprises physically contacting said conductive material against a remaining portion of said insulative material to expose said portion of said corrosion susceptible metal by breaking through said protective barrier without a separate etch step.