Assembly process
AssigneeInfotech AG
InventorsEdison T. Hudson, Ernest H. Fischer
Life of this patent
Estimating the term…
Abstract
A method and apparatus for component to substrate assembly permits in situ reflow of a flip chip (or other suitable component) in a manner which promotes proper settling of the component as solder begins to flow at the contact points between the component and the substrate. The component is heated and held by a pick-up head while applying downforce that serves to level the component. The initiation of solder reflow can be detected with the pick-up head by sensing a decrease in the downforce. Downforce applied to the component with the pick-up head is then decreased and the retention mechanism holding the component is released, freeing the component from the pick-up head and permitting the component to properly self-center using the liquid solder's surface tension.
Claims11
A method for in situ assembly of a flip chip semiconductor package to a substrate, comprising:
- positioning a pick-up head holding the package over the substrate;
- lowering the package into contact with the substrate;
- applying a downforce to the package;
- applying heat to the package;
- monitoring the downforce;
- and
- removing all downforce when a reduction in downforce is detected.
A method for assembling a semiconductor package to a substrate, comprising:
- holding the package on a pick-up head of a placement machine;
- placing the package onto the substrate;
- applying a downforce to the package;
- heating the package and the substrate from a heater disposed on the pick-up head;
- sensing the downforce being applied to the package;
- and
- decreasing the applied downward force in response to sensing a decrease in the downforce.
A method for assembly of a component to a substrate, comprising:
- positioning a pick-up head holding the component over the substrate;
- lowering the component into contact with the substrate;
- applying a compressive force between the component and the substrate;
- performing a bonding process to bond the component to the substrate;
- monitoring the compressive force;
- and
- removing all compressive force when a reduction in compressive force is detected.
Dependencies are inferred from the claim text.