Semiconductor device and production process thereof
AssigneeRohm Co., Ltd.
InventorKazutaka Shibata
Life of this patent
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Abstract
A semiconductor device having a pad for electrical connection provided on a semiconductor substrate, a first insulating film with which a surface of the semiconductor substrate is coated and having an opening to which the pad is exposed, a conductive film joined to the pad on a bottom surface of the opening of the first insulating film and extending to a surface of the first insulating film outside the opening, a second insulating film with which the conductive film is coated and having an opening to which a part of the conductive film is exposed, and a connecting member arranged so as to be joined to the conductive film inside the opening of the second insulating film.
Claims6
A process of producing a semiconductor device, comprising the steps of:
- coating a surface of a semiconductor substrate, provided with a pad for electrical connection, with a first insulating film having an opening to which the pad is exposed;
- modifying a surface of the first insulating film and an inner wall surface of the opening;
- forming, by an ion-exchange reaction, a thin conductive film with which the surface of the first insulating film, the inner-wall surface of the opening, and a surface of the pad exposed on a bottom surface of the opening is coated;
- thickening the thin conductive film by electroplating with power fed using the thin conductive film;
- forming a second insulating film with which the thickened conductive film is coated and having an opening to which a part of the conductive film is exposed;
- and
- forming a connecting member joined to the thickened conductive film inside the opening of the second insulating film.
A process of producing a semiconductor device, comprising the steps of:
- forming an insulating film on a semiconductor substrate;
- modifying a surface of the insulating film;
- forming a thin conductive film by an ion-exchange reaction on the modified surface of the insulating film;
- and
- thickening the thin conductive film by electroplating with power fed using the thin conductive film.
Dependencies are inferred from the claim text.