Bonding paste applicator and method of using it

Abstract

The object of the present invention is to provide a bonding paste applicator and a method of applying a bonding paste which allow satisfactory paste applying quality and excellent operability to be realized. A bonding paste application method for applying a bonding paste by making a drawing with a paste applying nozzle made to move to a position, where a chip is mounted on a substrate, comprises the steps of storing in advance in a storing unit 46 a drawing pattern for controlling each of X, Y and Z axes to move a paste applying nozzle and a drawing pattern setting table 53 to show a category corresponding to the size of a chip to be bonded, selecting a drawing pattern corresponding to the size of the chip, which has been designated, by means of a drawing pattern selecting unit 54 and obtaining a speed pattern for each of the X, Y and Z axes based on the selected drawing pattern by means of a speed pattern computing unit 55. Accordingly, it is no longer required to set up a drawing pattern every time occasion demands and a paste can be applied properly with excellent paste applying quality and satisfactory operability without fail.

Dependencies are inferred from the claim text.