Compliant and crosslinkable thermal interface materials
AssigneeHoneywell International Inc.
InventorsMy Nguyen, James Grundy, Carl Edwards
Life of this patent
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Abstract
Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.
Claims22
A compliant and crosslinkable material useful as an interface material for electronic devices comprising at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler.
A dispensable paste of a compliant and crosslinkable material useful as an interface material for electronic devices comprising at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler.
A sheet or film of a compliant and crosslinkable material useful as an interface material for electronic devices comprising at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler.
A method of making a compliant and crosslinkable material comprising combining at least one silicone resin mixture with at least one wetting enhancer and at least one thermally conductive filler.
A method of increasing the thermal conductivity of a polymer comprising incorporating therein carbon micro fibers and at least one thermally conductive filler.
Dependencies are inferred from the claim text.