Electroplating of copper from alkanesulfonate electrolytes
AssigneeAtofina Chemicals, Inc.
InventorsNicholas M. Martyak, Michael D. Gernon, Patrick Janney
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Abstract
Disclosed is an improved electrolyte formulation for the electrodeposition of copper onto electronic devices substrates and a process using the formulation. The formulation is a solution which contains copper alkanesulfonate salts and free alkanesulfonic acids and which is intended for the metallization of micron or sub-micron dimensioned trenches or vias.
Claims14
A solution for copper electroplating which contains copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration from about 0.25 to about 1.75 M, and which is intended for the metallization of micron or sub-micron dimensioned trenches or vias.
A process for the metallization of micron or sub-micron dimensioned trenches or vias, wherein the process employs an electroplating solution containing copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration of from about 0.25 to about 1.75 M, and electric current is passed through the solution to electroplate copper unto a substrate.
Dependencies are inferred from the claim text.