Multi-layer deposition process using four ring sputter sources
AssigneeSeagate Technology LLC
InventorPaul Stephen McLeod
Life of this patent
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Abstract
A sputtering apparatus for depositing layers of material onto a substrate includes a vacuum chamber, a first target and a second target positioned within the vacuum chamber. A source of power is placed in electrical communication with the first target and the second target. A switch alternately connects the source of power between the first target and the second target. The first target and the second target are different materials. The switch connects power to the first target when the transport mechanism positions the substrate near the first target and the switch connects power to the second target when the transport mechanism positions the substrate closer to the second target.
Claims19
A sputtering apparatus for depositing layers of material onto a substrate comprising:
- a vacuum chamber;
- a first target positioned within the vacuum chamber;
- a second target positioned within the vacuum chamber;
- a source of power in electrical communication with the first target and the second target;
- a switch for alternately connecting the source of power between the first target and the second target;
- and
- a transport mechanism for moving a substrate between a first position closer to the first target and a second position, wherein the transport mechanism passes the substrate near one of the first target or the second target.
A sputtering apparatus for depositing layers of material onto a substrate comprising:
- a vacuum chamber;
- a first target positioned within the vacuum chamber;
- a second target positioned within the vacuum chamber;
- a source of power in electrical communication with the first target and the second target;
- and
- a switch for alternately connecting the source of power between the first target and the second target, wherein the first target is ring-shaped and the second target is ring shaped.
A sputtering apparatus for depositing layers of material onto a substrate comprising:
- a vacuum chamber;
- a first target positioned within the vacuum chamber;
- a second target positioned within the vacuum chamber;
- a source of power in electrical communication with the first target and the second target;
- and
- a switch for alternately connecting the source of power between the first target and the second target;
- a third target;
- a fourth target, wherein the first target, second target, third target, and fourth target are ring-shaped;
- and
- a transport mechanism for moving a substrate between a first position between the first target and the third target, and a second position between the second target and the fourth target.
A method for sputtering within a chamber, the method comprising the steps of:
- placing at least two source materials within a chamber;
- electrically connecting a source of power to one of the source materials within the chamber to sputter a first layer onto a substrate;
- disconnecting a source of power from one of the source materials and electrically connecting the source of power to the other of the source materials within the chamber to sputter a second layer onto a substrate;
- spinning the substrate substantially about an axis of the substrate;
- and
- moving the substrate linearly along the axis of the substrate.
A sputtering apparatus for depositing layers of material onto a substrate comprising:
- a vacuum chamber;
- a first target positioned within the vacuum chamber;
- a second target positioned within the vacuum chamber;
- a source of power in electrical communication with the first target and the second target;
- a switch for alternately connecting the source of power between the first target and the second target;
- and
- a transport mechanism for moving a substrate between a first position closer to the first target and a second position closer to the second target, wherein the transport mechanism includes:
- a portion adapted to rotate the substrate about an axis associated with the substrate;
- and
- a portion that moves the substrate linearly substantially along the axis associated with the substrate.
Dependencies are inferred from the claim text.