CMP compositions containing silver salts

Abstract

The invention provides a method of polishing a nickel-containing substrate comprising (i) contacting the substrate with a chemical-mechanical polishing system comprising an abrasive, a polishing pad, or both an abrasive and a polishing pad, a silver salt comprising a silver ion, and a liquid carrier, and (ii) abrading at least a portion of the substrate to polish the substrate. The invention further provides a chemical-mechanical polishing system comprising (a) an abrasive, a polishing pad, or both an abrasive and a polishing pad, (b) a liquid carrier, (c) a silver salt comprising a silver ion, and (d) a secondary oxidizing agent, wherein the amount of the silver ion is about 0.1 wt. % to about 3 wt. % and the wt. % amount of the secondary oxidizing agent is about 3 times or less than the wt. % amount of the silver ion, based on the weight of the liquid carrier and anything dissolved or suspended therein.

Dependencies are inferred from the claim text.