Low pitch, high density connector
AssigneeTeledyne Technologies Incorporated
InventorsRalph Maldonado, Peter A. Kurbikoff, Thomas E. Mowry
Life of this patent
Estimating the term…
Loading patent…
AssigneeTeledyne Technologies Incorporated
InventorsRalph Maldonado, Peter A. Kurbikoff, Thomas E. Mowry
Estimating the term…
The present invention is directed to an improved electrical connector for electrically connecting a first component to a second component. The connector includes a plurality of electrical conductors partially embedded in a dielectric frame. The frame is formed with a first side and a second side opposed to the first side. Each conductor includes a first finger, a second finger and a midsection connecting the first finger to the second finger. The midsection of each conductor is molded in place within the frame. The first finger of each conductor extends away from the first side of the frame while the second finger of each conductor extends away from the second side of the frame. The midsections of adjacent conductors can be spaced apart within the frame at distances of less than 1.5 mm.
A connector for electrically connecting a first component with a second component, said connector comprising:
Dependencies are inferred from the claim text.