High frequency hermetic connector with ground lip
AssigneeAnritsu Corporation
InventorWilliam Oldfield
Life of this patent
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Abstract
The present invention incorporates a hermetic glass bead 206 and a grounding lip 208 into an outer conductor insert 216 to form a microwave coax connector 201. The glass bead 206 forms both the hermetic seal and the support for the coax center conductor pin 214. The outer conductor insert 216 of the coax connector 201 includes the ground lip 208 to provide a short ground path for the connection to a microstrip substrate 10 provided on a carrier 12 in a housing 2. The coax connector 201 is soldered into a cavity 235 in the housing 2 to assure a short ground path between the coax connector 201 and the carrier 12. There is no need for soldering a separate glass bead into the housing 2, which at these high frequencies, is very difficult due to the small size of the glass bead.
Claims6
A connector assembly comprising:
- a coaxial connector;
- a microstrip substrate;
- a housing supporting the microstrip substrate attached to a carrier, the housing including an opening for insertion of the coaxial connector;
- a connector interface device, whereby the connector interface device is provided in a cavity in the coaxial connector, the connector interface device comprising:
- a first center conductor pin;
- an outer conductor insert with a cylindrical first end and a second end, with the cylindrical first end including a first bore, and a first counter bore in the first bore;
- a glass bead located within the first counter bore of the outer conductor, such that the glass bead supports the first center conductor pin, whereby the glass bead is hermetically sealed by solder applied between the glass bead and the outer conductor;
- and
- a ground lip for forming an extension from the coaxial connector, the ground lip extending from the second end of the outer conductor insert and forming a half cylinder, the ground lip supporting the carrier to provide a ground path for a microstrip substrate mounted on the carrier, the ground lip for extending into the opening in the housing and making electrical contact with the housing.
Dependencies are inferred from the claim text.