Method for manufacturing a piezoelectric device
AssigneeMurata Manufacturing Co., Ltd.
InventorsKunio Sawai, Motohide Yonemura, Syuji Fujii
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AssigneeMurata Manufacturing Co., Ltd.
InventorsKunio Sawai, Motohide Yonemura, Syuji Fujii
Estimating the term…
A method for manufacturing a piezoelectric device includes the steps of providing a piezoelectric substrate having a piezoelectric driving unit and laminating outer coating substrates on major surfaces thereof via adhesive layers. Each of the adhesive layers includes a first layer of an adhesive having a Shore D hardness after curing of not more than approximately 60 and disposed so as not to be exposed in a region of lateral side surfaces of the layered body provided with the external electrodes, second and third layers of an adhesive having a Shore D hardness of at least approximately 60, and the third layer of having a viscosity before curing of at least approximately 3.0×105 mPas at a temperature of 25° C. The third layer is disposed between the periphery of the first layer and the region of the lateral side surfaces of the layered body provided with the external electrodes.
A method for manufacturing a piezoelectric device including a piezoelectric substrate provided with driving electrodes on the opposing major surfaces, a plurality of outer coating substrates, each of which is laminated on one of the opposing major surfaces of said piezoelectric substrate, adhesive layers arranged to bond the piezoelectric substrate and the outer coating substrates to each other at the opposing major surfaces of the piezoelectric substrate, and a plurality of external electrodes provided in regions of a lateral side surfaces of a layered body including said piezoelectric substrate, said outer coating substrates, and said adhesive layers, wherein each of the adhesive layers includes a first layer of an adhesive which is arranged so as not to be exposed in the regions of the lateral side surfaces of the layered body provided with the plurality of external electrodes thereon, a second layer of an adhesive, and a third layer of an adhesive, the third layer being disposed between portions of the periphery of the first layer and the regions of the lateral side surfaces of the layered body provided with the plurality of external electrodes thereon, and wherein said second layer is laminated on said first layer and said third layer, the method comprising the steps of:
A method for manufacturing a piezoelectric device including a piezoelectric substrate provided with driving electrodes on the opposing major surfaces a plurality of outer coating substrates, each of which is laminated on one of the opposing major surfaces of said piezoelectric substrate, adhesive layers arranged to bond the piezoelectric substrate and the outer coating substrates to each other at the opposing major surfaces of the piezoelectric substrate, and a plurality of external electrodes provided in regions of a lateral side surfaces of a layered body including said piezoelectric substrate, said outer coating substrates, and said adhesive layers, wherein each of the adhesive layers includes a first layer of an adhesive having a Shore D harness after curing of not more than approximately 60 which is provided so as not to be exposed in the regions of the lateral side surfaces of the layered body provided with the plurality of external electrodes thereon, a second layer of an adhesive having a Shore D hardness after curing of at least approximately 60, and a third layer of an adhesive having a Shore D hardness after curing of at least approximately 60, and having a viscosity before curing of at least approximately 3.0×105 mPas, the third layer being disposed between portions of the periphery of the first layer and the regions of the lateral side surfaces of the layered body provided with the plurality of external electrodes thereon, and wherein said second layer is laminated on said first layer and said third layer, the method comprising the steps of:
Dependencies are inferred from the claim text.