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US 6,603,807 B1Granted
Isolator and a modem device using the isolator
AssigneeHitachi, Ltd.
InventorsSeigoh Yukutake, Yasuyuki Kojima, Minehiro Nemoto, Masatsugu Amishiro, Takayuki Iwasaki, Shinichiro Mitani, Katsuhiro Furukawa, Chiyoshi Kamada, Atsuo Watanabe, Takayuki Oouchi, Nobuyasu Kanekawa
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Abstract
An isolator is made monolithic by forming a capacitive insulating barrier using an interlayer insulation film on the semiconductor substrate to miniaturize the modem device by the monolithic isolator.
Claims17
An isolator comprising;
- a semiconductor substrate;
- primary and secondary side circuits provided on said semiconductor substrate;
- and
- a capacitive insulating means positioned on said semiconductor substrate for transferring signals between said primary and secondary sides and for insulating and separating said primary side circuit from said secondary side circuit, either said primary side circuit operating as a driver circuit to input signals to said capacitive insulating means and said secondary side circuit operating as a receiver to output a predetermined signal by detecting signals inputted to said capacitive insulating means, or said secondary side circuit operating as a driver circuit to input signals to said capacitive insulating means and said primary side circuit operating as a receiver to output a predetermined signal by detecting signals inputted to said capacitive insulating means.
1 more element
An isolator comprising;
- a semiconductor substrate;
- primary and secondary side circuits provided on said semiconductor substrate and insulated from each other;
- and
- a capacitive insulating means positioned on said semiconductor substrate for transferring signals between said primary and secondary sides and for insulating and separating said primary side circuit from said secondary side circuit, said capacitive insulating means comprising a capacitor having an insulation layer positioned on said semiconductor substrate and a plurality of electrodes,
- one of said electrodes being bridged between said primary side circuit and secondary side circuit in a floating state.
2 more elements
An analog front end comprising:
- a semiconductor substrate;
- primary and secondary side circuits provided on said semiconductor substrate and insulated from each other;
- a capacitive insulating means positioned on said semiconductor substrate for transferring signals between said primary and secondary side circuits and for insulating and separating said primary side circuit from said secondary side circuit;
- and
- an analog input-output side circuit and a digital input-output side circuit,
- wherein signals are transferred between said analog input-output side circuit and digital side circuit, and said analog input-output side input-output circuit and digital input-output circuit are isolated and separated by said isolator.
3 more elements
An integral circuit including an analog front end, said analog front end comprising:
- an analog input-output side circuit region;
- a digital input-output side circuit region;
- an isolator region including an isolator, said isolator region including a semiconductor substrate,
- primary and secondary side circuits provided on said semiconductor substrate and insulated from each other;
- and
- a capacitive insulating means positioned on said semiconductor substrate for transferring signals between said primary and secondary side circuits and for insulating and separating said primary side circuit from said secondary side circuit,
- wherein said isolator region is positioned between said analog input-output side circuit region and said digital input-output side circuit region and transfers signals between said analog input-output side circuit region and said digital input-output side circuit and insulates and separates said analog input-output side circuit region and said digital input-output side circuit region.
4 more elements
A communication system comprising:
- a network;
- a transceiver connected to said network;
- an application control means for transmitting and receiving signals with said network through said transceiver;
- and
- an isolator for insulating and separating between said transceiver and said application control means;
- said isolator including:
- a semiconductor substrate;
- primary and secondary side circuits provided on said semiconductor substrate and insulated from each other;
- and
- a capacitive insulating means positioned on said semiconductor substrate for transferring signals between said primary and secondary side circuits and for insulating and separating said primary side circuit from said secondary side circuit.
7 more elements
Dependencies are inferred from the claim text.