US 6,603,667 B2 · Electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic

Abstract

The invention provides an electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic. Capacitors and a wiring pattern are formed on an alumina substrate by means of thin film forming technique, and a part of the wiring pattern is served as the connection land for mounting a bare chip of a transistor. Among the capacitors, the top electrode of the capacitor is served also as a part of the connection land, and the bottom side collector electrode of the bare chip is connected to the connection land by use of conductive adhesive. Top electrodes of the residual capacitors are served as the bonding pad, and the base electrode and the emitter electrode on the top side of the bare chip are connected to the top electrodes of the respective capacitors by a wire.

Claims6

Dependent claims

An electronic circuit unit comprising:

an alumina substrate;
a thin film conducting pattern formed on the alumina substrate;
thin film circuit elements including capacitors, resistors, and inductance elements formed on the alumina substrate and connected to the conducting pattern;
and
a semiconductor bare chip wire bonded to the conducting pattern,
wherein an area of a connection land on which the semiconductor bare chip is mounted is smaller than a bottom surface area of the semiconductor bare chip.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

09/870,416Filed 29 May 2001

Priority

JP 2000-16027830 May 2000

Published

US 2002/0011352 A131 Jan 2002

Granted

5 Aug 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification13 codes

H05K 3/403
Forming printed elements for providing electric connections to or between printed circuits: edge contacts; Windows or holes in the substrate…
H10W 44/20
Electrical arrangements for controlling or matching impedance: at high-frequency [HF] or radio frequency [RF]
H05K 1/0306
Use of materials for the substrate: inorganic insulating substrates, e.g. ceramic, glass
H05K 1/092
Use of materials for the conductive, e.g. metallic pattern: dispersed materials, e.g. conductive pastes or inks

Electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic

Life of this patent

Electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic

Life of this patent

Abstract

Claims6