Microminiature movable device
AssigneeJapan Aviation Electronics Industry, Limited
InventorKeiichi Mori
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AssigneeJapan Aviation Electronics Industry, Limited
InventorKeiichi Mori
Estimating the term…
On the top of a central protrusion 81 of a stationary electrode substrate 80 there is formed a stationary electrode 84A. A movable electrode plate 12 is supported at both sides thereof to a support frame 10 through flexures 19 and anchor parts 11. The movable electrode plate 12 is held displaceable vertically to the stationary electrode 12. The marginal edge of the protrusion 81 merges into a sloping face, on which an auxiliary electrode 84B is formed. In the case of separating the movable electrode plate 12 from the stationary electrode 84a, a voltage is applied between them.
A microminiature movable device comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
The reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD: the reflecting element being moved or deformed by electrostatic means
Optical elements, systems or apparatus
Term ended 19 Mar 2022 (estimated)
The present invention relates to a microminiature movable device and, more particularly, to a microminiature movable device in which an auxiliary electrode is formed on a stationary substrate together with a stationary electrode to prevent a movable electrode plate from sticking or adhering to the stationary substrate.
To facilitate a better understanding of the present invention, a description will be given first, with reference to FIGS. 1A and 1B, of a prior art example of a microminiature movable device.
The illustrated microminiature movable device is manufactured using a silicon (Si) single crystal wafer as the starting substrate through application of micromachining technology including thin-film growth, photolithography and etching techniques. The silicon single crystal wafer is ultimately machined into such a square support frame 10 as depicted in FIGS. 1A and 1B. The support frame 10 has formed integrally therewith anchor parts 11 located centrally on a pair of opposed sides of the frame, flexures 19 extended inwardly from the anchor parts 11 and a rectangular movable electrode plate 12 connected centrally at its both sides to inner ends of the flexures 19.
FIG. 1A is a plan view for explaining an example of a conventional microminiature movable device applied to an optical switch;
FIG. 1B is a sectional view of the microminiature movable device taken along the line 1B—1B in FIG. 1A;
FIG. 2A is a plan view for explaining the operation of the conventional microminiature movable device applied to the optical switch;
With reference to the accompanying drawings, embodiments of the present invention will be described below.
Referring first to FIGS. 3A to 3J, a description will be given first of the steps involved in the manufacture of an optical switch using a silicon single-crystal wafer as the starting substrate through application of micromachining techniques such as thin film forming, photolithography and etching techniques.
Step S1 (FIG. 3A): Prepare a silicon single-crystal wafer 10′ that is a starting substrate.