Probe card for high speed testing
AssigneeGGB Industries, Inc.
InventorsHarry J. Boll, Gregory G. Boll
Life of this patent
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Abstract
Epoxy probe cards are modified by mounting passive and/or active electronic components on the insulating surface of the probe card and connecting those components to the probe wires with short, electrically conductive lines that are formed on the probe card surface by printed circuit techniques. Ordinary wire probes may be interspersed with coaxial probes and probes with electrically conducting tips bonded to electrically insulating shanks. An auxiliary printed circuit board containing additional electronic components may be included to accommodate especially sensitive test points. The resulting probe structure is intended to extend the frequency range of the well-developed epoxy probe card technology while retaining its ruggedness and low cost features.
Claims5
An electronic probe apparatus for testing an electronic circuit comprising an array of probe wires having tip ends adapted to contact said electronic circuit, said probe wires extend outward from said tip ends and extend into an epoxy material and are held in place therein, said epoxy material has an electrically insulating surface and has electronic components mounted on said insulating surface, connections are being made between said components and said probe wires by electrically conducting lines formed on said insulating surface of said epoxy material, said connections are being made between said conducting lines and said probe wires between said tip ends and said epoxy material.
An electronic probe apparatus for testing an electronic circuit comprising an array of probe wires having tip ends adapted to contact said electronic circuit, said probe wires extend outward from said tip ends and extend into an epoxy material and are held in place therein, said epoxy material has an electrically insulating surface and has electrical conductors mounted on said insulating surface, connections are being made between said electrical conductors and said probe wires on said insulating surface of said epoxy material, said connections are being made between said conducting lines and said probe wires between said tip ends and said epoxy material.
Dependencies are inferred from the claim text.