Method and apparatus for reducing ozone output from ion wind devices
AssigneeZenion Industries, Inc.
InventorJim L. Lee
Life of this patent
Estimating the term…
Loading patent…
AssigneeZenion Industries, Inc.
InventorJim L. Lee
Estimating the term…
Ozone output in ion wind devices using one or more emitters (10) and an array of collectors (20) (accelerators) may be reduced through catalytic conversion of the produced ozone back to oxygen by using various materials placed in or downstream from the airflow, such as a manganese dioxide coating on the accelerator substrate elements. Precious metal or activated carbon coatings may also be used for the purpose of converting ozone to oxygen.
A method for reducing ozone output from ion wind devices, said method comprising the steps of:
An ion wind device comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
Using physical phenomena: ionisation
Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect: combinations of electrostatic separation with other…
Constructional details or accessories or operation thereof: particle charging or ionising stations, e.g. using electric discharge, radioactive…
Constructional details or accessories or operation thereof: applications of electricity supply techniques
Term ended 21 Jun 2022 (estimated)
1. Technical Field
This invention relates generally to ion generators and ion wind devices, and more specifically to an improved method and apparatus for reducing the ozone output from ion wind devices.
2. Background Art
FIG. 1 is a schematic view of an emitter and accelerator array of an ion wind device; and
FIG. 2 is a side elevation view of an apparatus for plating manganese to an accelerator substrate.
FIG. 1 is a schematic view of a typical ion wind array. The emitter or emitters 10 are typically constructed of 0.1 mm pure tungsten wire and may be of any length. The collectors (also referred to as accelerators) 20 are typically constructed of any non corrosive conductive material such as copper, aluminum, stainless steel, or brass. The emitter 10 is always located opposite and at the center (A) of the opening of the accelerators 20. The equidistant (B) of the emitter to the leading edge (radius) of the accelerators 20 may vary depending upon desired operational effect, but is typically one inch. This is also true of the spacing (C) between accelerators.
The differential voltage applied across the array must be at least 6,500 volts in order to effect any substantial ion mobility and subsequent airflow. Typical configurations consist of applying a positive high voltage to the emitter and a negative high voltage to the collector to achieve a maximum differential voltage of 15,000 volts D.C. These voltage potentials may be reversed, however, when this is done an uneven plasma envelope is developed at the emitter source, which results in excessive production of corona noise and ozone production. The array may be driven by a single positive or a single negative high voltage excitation source to the emitter with the collectors having a high impedance return to ground (to reduce load current and breakover arcing). Also, the excitation voltage may be modulated in ways taught in U.S. Pat. No. 4,789,801 to achieve desired results.
FIG. 2 is a side elevation view of an apparatus for plating manganese to an accelerator substrate 20. Plating tank 30 is filled with a solution 32 of manganese sulfate, ammonium sulfate, and EDTA in distilled water, and mixed a with magnetic stirring plate 34 and spin bar 36. Bath heater 38 may be used to maintain the bath temperature at 40 degrees C. Power supply 40 negative lead 42 is connected to accelerator substrate 20, and positive lead 44 is connected to one or more manganese plates or rods 46, and the substrate and manganese rods are placed in the plating tank 30. The power supply is energized for an appropriate period to plate a desired layer of manganese onto the substrate 20. After the plating process, the manganese coating on the substrate is oxidized as by immersion in a hydrogen peroxide solution.