Semiconductor module and producing method therefor

A semiconductor module comprising:

• at least one electric element including a semiconductor chip;
• an electrically conductive layer connected electrically to the electric element;
• an electrically conductive joint arranged between the electric element and the electrically conductive layer to connect electrically the electric element and the electrically conductive layer to each other;
• a molding resin covering at least partially the electric element and the electrically conductive joint;
• and
• an electrically insulating layer contacting at least partially the electrically conductive layer;
• wherein the electrically conductive layer includes a first layer of Nickel-base metal, and a second layer of Copper-base metal extends at least partially between the first layer and the electric element, and
• a surface of the first layer prevented from facing to the electric element extends between the electric element and a surface of the electrically insulating layer prevented from facing to the electric element, in a thickness direction of the electrically conductive layer.

A semiconductor module comprising:

• at least one electric element including a semiconductor chip;
• an electrically conductive layer connected electrically to the electric element;
• an electrically conductive joint arranged between the electric element and the electrically conductive layer to connect electrically the electric element and the electrically conductive layer to each other;
• a molding resin covering at least partially the electric element and the electrically conductive joint;
• an electrically insulating layer contacting at least partially the electrically conductive layer;
• and
• a film of Nickel-base metal extending on a surface of the electrically insulating layer prevented from facing to the electric element.

A semiconductor module comprising:

• at least one electric element including a semiconductor chip;
• an electrically conductive layer connected electrically to the electric element;
• an electrically conductive joint arranged between the electric element and the electrically conductive layer to connect electrically the electric element and the electrically conductive layer to each other;
• a molding resin covering at least partially the electric element and the electrically conductive joint;
• an electrically insulating layer contacting at least partially the electrically conductive layer;
• and
• a metallic film extending on a surface of the electrically insulating layer prevented from facing to the electric element, wherein the metallic film is electrically connected to the electrically conductive layer.

A semiconductor module comprising:

• at least one electric element including a semiconductor chip;
• an electrically conductive layer connected electrically to the electric element;
• an electrically conductive joint arranged between the electric element and the electrically conductive layer to connect electrically the electric element and the electrically conductive layer to each other;
• a molding resin covering at least partially the electric element and the electrically conductive joint;
• an electrically insulating layer contacting at least partially the electrically conductive layer;
• and
• a metallic film extending on a surface of the electrically insulating layer prevented from facing to the electric element, wherein the metallic film is magnetically permeable.