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US 6,603,205 B2Granted
Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components
AssigneeFcm Co., Ltd.
InventorShigeki Miura
Life of this patent
Estimating the term…
Abstract
A material for an electronic component having a plating layer A formed of metals X and Y mixed with each other on a base metal material and a coating layer B formed of the metal X provided on the plating layer A is provided, whereby wettability of soldering is satisfactory ensured, degradation of solderability and appearance is prevented and generation of whiskers can also be prevented.
Claims6
A material for an electronic component, having
- a plating layer A formed of a metal X and a metal Y mixed with each other, on a metal material as a base material;
- and
- a coating layer B formed of the metal X, on said plating layer A, wherein
- said metal X is tin, and said metal Y is a mixture of silver and copper.
1 more element
A material for an electronic component, having
- a plating layer A formed of a metal X and a metal Y mixed with each other, on a metal material as a base material;
- and
- a coating layer B formed of the metal X, on said plating layer A, wherein
- said metal X is tin, and said metal Y is a mixture of silver and bismuth.
1 more element
A material for an electronic component, having
- a plating layer A formed of a metal X and a metal Y mixed with each other, on a metal material as a base material;
- and
- a coating layer B formed of the metal X, on said plating layer A, wherein
- said metal X is tin, and said metal Y is a mixture of silver, bismuth, and copper.
1 more element
A material for an electronic component, having
- a plating layer A formed of a metal X and a metal Y mixed with each other, on a metal material as a base material;
- and
- a coating layer B formed of the metal X, on said plating layer A, wherein
- said metal X is tin, and said metal Y contains at least one of zinc, bismuth and indium.
1 more element
A material for an electronic component, having
- a plating layer A formed of a metal X and a metal Y mixed with each other, on a metal material as a base material;
- and
- a coating layer B formed of the metal X, on said plating layer A, wherein
- said metal X is tin, said metal Y contains at least one of silver, zinc, bismuth and indium, and said coating layer B has a thickness of equal to or more than 0.05 μm and equal to or less than 1.0 μm.
1 more element
Dependencies are inferred from the claim text.